TECBOND™ 7784

High and low temperature resistant multi-purpose polyamide adhesive.

  • Reference: TECBOND® 7784

  • Open Time: Medium

  • Chemistry: Polyamide

  • Heat Resistant To: 105 °C

  • Low Temp Flex: -60 °C

  • Viscosity: Medium

  • Links: 12mm15mm43mmCT

SUPPORTING FILES SIZE DATE
Safety Data Sheet 398.6 kB 30th November 2016
Substrate Score
ABS 8
FLEXIBLE PVC 7
HARD WOOD 7
POLYCARBONATE 6
POLYSTYRENE 6
RIGID PVC 6
GRP 6
ALUMINIUM 6
STAINLESS STEEL 6
SOFT WOOD 6
CARDBOARD 6
EXPANDED POLYSTYRENE 5
SAND MOLD 4
GLASS 4
PU FOAM 4
LDPE 2
HDPE 2
POLYPROPYLENE 2
UV VARNISH 2