TECBOND™ 7786

  • Reference: TECBOND® 7786

  • Open Time: Medium

  • Chemistry: Polyamide

  • Heat Resistant To: 135 °C

  • Low Temp Flex: -35 °C

  • Viscosity: Medium

  • Links: 12mm15mm43mmCT

Substrate Score
ABS 8
POLYCARBONATE 6
POLYSTYRENE 6
RIGID PVC 6
FLEXIBLE PVC 6
GRP 6
ALUMINIUM 6
STAINLESS STEEL 6
SOFT WOOD 6
HARD WOOD 6
CARDBOARD 6
SAND MOLD 4
GLASS 4
PU FOAM 4
LDPE 2
HDPE 2
POLYPROPYLENE 2
EXPANDED POLYSTYRENE 2
UV VARNISH 2
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