TECBOND™ LM44

Lowmelt, fast setting, high performance, white adhesive. Ideal for expanded polystyrene, thin films and balloons.

  • Reference: TECBOND® LM44

  • Open Time: Short

  • Chemistry: EVA

  • Heat Resistant To: 75 °C

  • Low Temp Flex: -7 °C

  • Viscosity: Low

  • Links: 12mm15mm43mmCT

SUPPORTING FILES SIZE DATE
Safety Data Sheet 398.67 kB 30th November 2016
Substrate Score
CARDBOARD 9
GRP 6
EXPANDED POLYSTYRENE 6
SOFT WOOD 6
POLYCARBONATE 4
ALUMINIUM 4
ABS 2
LDPE 2
HDPE 2
POLYPROPYLENE 2
POLYSTYRENE 2
RIGID PVC 2
FLEXIBLE PVC 2
STAINLESS STEEL 2
HARD WOOD 2
SAND MOLD 2
GLASS 2
PU FOAM 2
UV VARNISH 2